Revealing thermal effects in the electronic transport through irradiated atomic metal point contacts

• Bastian Kopp,
• Zhiwei Yi,
• Daniel Benner,
• Fang-Qing Xie,
• Christian Obermair,
• Thomas Schimmel,
• Johannes Boneberg,
• Paul Leiderer and
• Elke Scheer

Beilstein J. Nanotechnol. 2012, 3, 703–711, doi:10.3762/bjnano.3.80

• Prior to the electron-beam lithography process, a thin polyimide layer and a double layer of electron-beam resists, MMA-MAA/PMMA, were deposited by spincoating on the wafer and soft-baked in an oven at 170 °C. The polyimide layer served for both planarization of the commercial glass substrate and for