Beilstein J. Nanotechnol.2012,3, 579–585, doi:10.3762/bjnano.3.67
the lamella. The purpose of this exposure geometry was to produce a wedge shape of silicon within the lamella so that we could observe the minimum thickness dimensions which can be fabricated by HIM. It also allows us to analyze the subsurface modification effects due to helium ionimplantation. All
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Figure 1:
(a) SEM image of the silicon lamella (sample 1) after FIB preparation. (b) HAADF TEM image of the s...