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Search for "photolithography" in Full Text gives 85 result(s) in Beilstein Journal of Nanotechnology.
3D Nanoprinting via laser-assisted electron beam induced deposition: growth kinetics, enhanced purity, and electrical resistivity
Beilstein J. Nanotechnol. 2017, 8, 801–812, doi:10.3762/bjnano.8.83
- combination of photolithography and electron beam lithography (EBL) were used to produce the two-contact pads with a spacing of 500 nm. An initial set of gold electrical contacts were patterned using photolithography and deposited with a thickness of 100 nm. A 3 nm titanium adhesion layer was deposited, prior
Silicon microgrooves for contact guidance of human aortic endothelial cells
Beilstein J. Nanotechnol. 2017, 8, 675–681, doi:10.3762/bjnano.8.72
- -defined topographical and chemical cues to assess cell micropatterning [12][13][14][15][16]. Some of these approaches are based on photolithography and reactive ion etching that in some cases are followed by anisotropic etching [17]. A simple and effective geometry previously described, involves line
- cardiovascular therapies [34]. The aim of this work was to prepare different collagen-coated silicon substrates with grooves by photolithography, and to study the cell behaviour on such structures compared with that on flat silicon substrates, used as control. Results and Discussion Fabrication of grooved
- silicon substrates To study the cellular response on surfaces with different geometry, different grooved substrates were produced in silicon wafers using standard photolithography and wet etching techniques [35][36]. The etching time in tetramethylammonium hydroxide (TMAH) was varied in order to generate
Anodization-based process for the fabrication of all niobium nitride Josephson junction structures
Beilstein J. Nanotechnol. 2017, 8, 539–546, doi:10.3762/bjnano.8.58
- lithography aggressive and high-energy etching processes such as ion milling and reactive ion etching (RIE) can be avoided. The use of anodization can reduce the number of mask and photolithography steps. In particular, it is not necessary to deposit further insulators to separate different metals in
Copper atomic-scale transistors
Beilstein J. Nanotechnol. 2017, 8, 530–538, doi:10.3762/bjnano.8.57
- . Keywords: electrochemistry; encapsulation; metallic atomic-scale transistor; nanotechnology; photolithography; Introduction Enormous research efforts worldwide are aimed at finding new solutions and technologies to manufacturing electronic components "beyond the silicon age". Resistive switching is one of
- scale integrated (ULSI) circuits, and its use as a working material for fully metallic atomic-scale transistors makes these devices adaptable for integration into advanced integrated circuits. The copper atomic-scale transistor is fabricated using standard photolithography and subsequent electrochemical
- steps. First, a silicon chip with three microfabricated electrodes – source, drain and gate – and a microchannel for on-chip electrolyte delivery are fabricated using standard photolithography (Figure 1a, Method 1 described in the Experimental section). The electrodes consist of Cr/Au films with a
Surface-enhanced Raman scattering of self-assembled thiol monolayers and supported lipid membranes on thin anodic porous alumina
Beilstein J. Nanotechnol. 2017, 8, 74–81, doi:10.3762/bjnano.8.8
- integrated into applications involving optical microscopy inspection, which requires flat planar substrates. Moreover, it allows to move toward a more robust engineering of APA surfaces by exploiting the standard microtechnology of photolithography, thereby paving the way to large scale fabrication in
Nanostructured SnO2–ZnO composite gas sensors for selective detection of carbon monoxide
Beilstein J. Nanotechnol. 2016, 7, 2045–2056, doi:10.3762/bjnano.7.195
- the simulations. Based on these results, the fifth version (see Figure 3) was selected for the deposition of the sensitive layer in order to obtain the final version of the gas sensor. Transducer fabrication using mask technology/photolithography The fabrication of the transducer was carried out using
- microprocessing technology. The masks for the heater and the interdigital electrode were patterned onto a porous alumina substrate (wafer) using photolithography, etching and lift-off processes. Using the working protocol of the laser lithography dedicated equipment (Heidelberg DWL66FS), the design was
Active and fast charge-state switching of single NV centres in diamond by in-plane Al-Schottky junctions
Beilstein J. Nanotechnol. 2016, 7, 1727–1735, doi:10.3762/bjnano.7.165
- the diamond surface using photolithography with subsequent thermal evaporation of the metals. Al is a Schottky contact showing a barrier height of 570 meV and Au is an Ohmic contact [18]. The contacts exhibit dimensions of 1 mm × 300 µm and were separated from each other by 400 µm. In order to have a
Thickness-modulated tungsten–carbon superconducting nanostructures grown by focused ion beam induced deposition for vortex pinning up to high magnetic fields
Beilstein J. Nanotechnol. 2016, 7, 1698–1708, doi:10.3762/bjnano.7.162
- , which favors the location of vortices in the thinnest parts of the superconductor for vortices perpendicular to the film [31]. In the past, some experiments were performed to generate microscale thickness modulation by pressing diffraction gratings on superconducting foils [25] or by photolithography
Nano- and microstructured materials for in vitro studies of the physiology of vascular cells
Beilstein J. Nanotechnol. 2016, 7, 1620–1641, doi:10.3762/bjnano.7.155
- techniques and the selection of materials for micro/nanostructured substrates as well as common geometries please refer to Table 1. 1.1 Fabrication methods In order to create tailored cell culture substrates with surface topographies established methods such as photolithography, electron- and focused-ion
- order to give an overview of different microfabrication techniques, relevant examples for different approaches such as optical (photolithography [49]), mechanical (hot embossing [50] and surface cracking [51][52]) or chemical (replica molding [53][54], phase separation micromolding [55][56][57], gas
- experiments in cell biology for the last two decades [53][54]. Photolithography uses light, a photomask and a photosensitive material (photoresist) to create a pattern in the micrometer (or sub-micrometer) range (Figure 4B). The thickness of the layer of photoresist will determine the height of the structures
The effect of dry shear aligning of nanotube thin films on the photovoltaic performance of carbon nanotube–silicon solar cells
Beilstein J. Nanotechnol. 2016, 7, 1486–1491, doi:10.3762/bjnano.7.141
- , <100>, with a 100 nm thermal oxide) by photolithography and defined circular active areas (0.08 cm2) in which the SiO2 was removed by buffered oxide etch. The films were deposited as described above and the cells were completed with GaIn eutectic back electrodes and mounted on steel support plates
NO gas sensing at room temperature using single titanium oxide nanodot sensors created by atomic force microscopy nanolithography
Beilstein J. Nanotechnol. 2016, 7, 1044–1051, doi:10.3762/bjnano.7.97
- deposition and a single Ti NW was created after lift-off. Au contact electrodes were subsequently created on the sides of the NW by standard photolithography. The details can be found in our previous reports [33][34]. For nano-oxidation, the tip was moved to the middle of the NW and a voltage pulse (−10 V
Dielectrophoresis of gold nanoparticles conjugated to DNA origami structures
Beilstein J. Nanotechnol. 2016, 7, 948–956, doi:10.3762/bjnano.7.87
- , the motion of the DNA origami structures, driven by pDEP, is well defined. The gold electrode array was fabricated by photolithography on a glass cover to monitor the motion and positioning of the YOYO®-1 stained 6HB by using fluorescence microscopy. The electrode pairs with the smallest distance of
Near-field visualization of plasmonic lenses: an overall analysis of characterization errors
Beilstein J. Nanotechnol. 2015, 6, 2069–2077, doi:10.3762/bjnano.6.211
- lithography, or nano-photolithography is employed. Especially for the stigmation, it strongly depends on the experience and the skill of the FIB operators. (a) Schematic diagram of the plasmonic structures for focusing based on elliptical slits. Orientation of the long axis of the elliptical slits is in x
Nanomechanical humidity detection through porous alumina cantilevers
Beilstein J. Nanotechnol. 2015, 6, 1332–1337, doi:10.3762/bjnano.6.137
- humidity sensitivity equal about 56 Hz/pg and about 100 Hz/%, respectively. The approach presented here for the design of anodic alumina cantilever arrays by the combination of anodic oxidation and photolithography enables easy control over porosity, surface area, geometric and mechanical characteristics
- foil with a conventional photolithography process (Figure 1). Using the lithography approach for AAO pattern formation mostly becomes possible due to selective and anisotropic etching of anodic alumina films on aluminium in basic solutions. On the other hand anodic oxidation itself enables easy control
- AAO cantilevers as humidity sensors at least in the humidity range of 10–22%. Conclusion The proposed combination of anodic oxidation and photolithography processes enables the successful formation of porous alumina cantilevers with desired geometric characteristics. Because of the high surface area
Tunable magnetism on the lateral mesoscale by post-processing of Co/Pt heterostructures
Beilstein J. Nanotechnol. 2015, 6, 1082–1090, doi:10.3762/bjnano.6.109
- electron microscope (SEM: FEI, Nova NanoLab 600). The SEM was equipped with a multi-channel gas injection system for FEBID. As substrates we used epi-polished c-cut (0001) Al2O3 with Cr/Au contacts of 3/50 nm thickness prepared by photolithography in conjunction with lift-off. The samples are one Co-FEBID
A scanning probe microscope for magnetoresistive cantilevers utilizing a nested scanner design for large-area scans
Beilstein J. Nanotechnol. 2015, 6, 451–461, doi:10.3762/bjnano.6.46
- prepared by a sequence of MEMS techniques including photolithography, reactive ion etching (RIE), ion beam etching (IBE) and wet etching. The cantilevers used in this study were 300 to 350 μm long and 40 μm wide. To ease the fabrication process thicknesses ranging from 10 μm to 20 μm were chosen. The
Electrical properties of single CdTe nanowires
Beilstein J. Nanotechnol. 2015, 6, 444–450, doi:10.3762/bjnano.6.45
- nanowire suspension was placed on Si/SiO2 substrates on which interdigitated Ti/Au electrodes were patterned by photolithography (Figure 4). FIBIM is a direct patterning method employed for the design of metallic nanostructures. The method is based on the interaction of an ion beam with the surface
- wires were harvested by ultrasonication into a suspension in chloroform. A droplet of nanowire suspension in semiconductor-grade chloroform was placed on a n++ Si/SiO2 substrate with patterned, interdigitated contracts. These were obtained by photolithography and sequential deposition of 20 nm of Ti and
Electrical response of liquid crystal cells doped with multi-walled carbon nanotubes
Beilstein J. Nanotechnol. 2015, 6, 396–403, doi:10.3762/bjnano.6.39
- were used. The cell thickness was 8.25 µm (more than the length of the MWCNTs). An active area of 1 cm2 was defined through photolithography by removing the ITO electrode of the outer surface. The LC alignment configuration was planar, i.e., with the LC director oriented parallel to the plane of the
Electrical contacts to individual SWCNTs: A review
Beilstein J. Nanotechnol. 2014, 5, 2202–2215, doi:10.3762/bjnano.5.229
- ion exchange surface chemistry approach. Tens of thousands of CNFETs were fabricated on the chip level with 78% yield. Chikkadi et al. [89] introduced a photolithography-based scalable fabrication process which provides a good platform for investigating the uniformity of CNFET performance on a large
Effect of channel length on the electrical response of carbon nanotube field-effect transistors to deoxyribonucleic acid hybridization
Beilstein J. Nanotechnol. 2014, 5, 2081–2091, doi:10.3762/bjnano.5.217
- , namely: (i) short channels (L = 6 µm), (ii) long channels (L = 300 µm), and (iii) ultra-long channels (L = 1500 µm). To obtain the short channel FETs, source–drain electrodes were patterned onto the substrates containing SWCNTs using standard photolithography (AZ7220, positive photoresist) at 25 ºC
- substrates containing the CVD-grown SWCNTs. The 1 µm thick SiO2 acted as the dielectric gate. Selective photoresist capping using photolithography was applied to cover the CNT–metal junction which resulted in devices with only the channel exposed. Only devices with a single CNT as a channel were considered
DNA origami deposition on native and passivated molybdenum disulfide substrates
Beilstein J. Nanotechnol. 2014, 5, 501–506, doi:10.3762/bjnano.5.58
- proteins [5][6], and act as templates for the organization of carbon nanotubes [6][7][8][9]. This bottom-up process offers a tremendous advantage over photolithography, because is enables the patterning of surfaces with feature sizes less than 20 nm [10]. However, some materials may interfere with the base
Effect of contaminations and surface preparation on the work function of single layer MoS2
Beilstein J. Nanotechnol. 2014, 5, 291–297, doi:10.3762/bjnano.5.32
- strained on the edge of the hole, it allows to experimentally compare the effect of two differently treated subtrates (SiO2 and RIE SiO2) on the same MoS2 flake. After identification of SLM areas, a Ti/Au (5 nm/15 nm) contact was patterned on the MoS2 flake by photolithography. We used the Photoresist ARP
Challenges in realizing ultraflat materials surfaces
Beilstein J. Nanotechnol. 2013, 4, 875–885, doi:10.3762/bjnano.4.99
- that utilize the optical near field generated in nanoscale semiconductor quantum structures and the dipole-forbidden near-field energy transfer. Moreover, near-field optics has been used to fabricate nanoscale structures beyond the diffraction limit of light. For example, photolithography has been used
- ], photolithography [24], and visible-light water splitting [25], as well as studies on photovoltaic devices [26] and energy up-conversion devices [27]. The efficiency of energy up-conversion by using DPP is reported to be more than three-fold higher than that of up-conversion by using conventional two-photon
Characterization of electroforming-free titanium dioxide memristors
Beilstein J. Nanotechnol. 2013, 4, 467–473, doi:10.3762/bjnano.4.55
- electron microscopy. The bottom and top electrodes consisted of Cr(5 nm)/Pt(15 nm) and Pt(30 nm), respectively, patterned perpendicular to each other by photolithography. In between these electrodes, a blanket switching layer was deposited with two different compositions. For standard devices, an amorphous
Functionalization of vertically aligned carbon nanotubes
Beilstein J. Nanotechnol. 2013, 4, 129–152, doi:10.3762/bjnano.4.14
- strategies are related to the first method in which the pre-patterning of the substrate is obtained by using shadow masks, photolithography and electron-beam-lithography (e-beam lithography). The first example, was given by Fan et al. [25]. These authors synthesized aligned carbon nanotubes in tower-like
- aligned nanotubes can be obtained by using substrates patterned with catalyst dots. High lateral resolution in the patterning of the substrate for site-selective growth of VA-CNTs can be achieved by photolithography with the use of high-contrast films as photomasks with features on the microscale [55][56
- nanotube patterns [67]. Photolithography followed by dry and/or wet etching can be used to pattern silicon oxide in different shapes and thickness allowing the design of a wide range of organized nanotube structures. An example is the beautiful patterns of multiply oriented, organized, flower-like
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