Synthesis of coaxial nanotubes of polyaniline and poly(hydroxyethyl methacrylate) by oxidative/initiated chemical vapor deposition

• Alper Balkan,
• Efe Armagan and
• Gozde Ozaydin Ince

Beilstein J. Nanotechnol. 2017, 8, 872–882, doi:10.3762/bjnano.8.89

• -beam evaporation, conventional lithography with a shadow mask was used to create a pattern for the electrodes. The photoresist AZ 5214 E (Merck GmbH), the developer AZ 726 (MIF) (Merck GmbH) and deionized water (stopper) were used for the lithography. After the e-beam evaporation, samples were annealed

Relationships between chemical structure, mechanical properties and materials processing in nanopatterned organosilicate fins

• Gheorghe Stan,
• Richard S. Gates,
• Qichi Hu,
• Kevin Kjoller,
• Craig Prater,
• Kanwal Jit Singh,
• Ebony Mays and
• Sean W. King

Beilstein J. Nanotechnol. 2017, 8, 863–871, doi:10.3762/bjnano.8.88

• layer and a hard mask. Standard 193 nm immersion lithography and etching techniques were utilized to form a grid pattern in the first backbone layer. A spacer dielectric was then deposited over the backbone grid and the backbone material was selectively removed. Standard plasma-etching techniques were

3D Nanoprinting via laser-assisted electron beam induced deposition: growth kinetics, enhanced purity, and electrical resistivity

• Brett B. Lewis,
• Robert Winkler,
• Xiahan Sang,
• Pushpa R. Pudasaini,
• Michael G. Stanford,
• Harald Plank,
• Raymond R. Unocic,
• Jason D. Fowlkes and
• Philip D. Rack

Beilstein J. Nanotechnol. 2017, 8, 801–812, doi:10.3762/bjnano.8.83

• combination of photolithography and electron beam lithography (EBL) were used to produce the two-contact pads with a spacing of 500 nm. An initial set of gold electrical contacts were patterned using photolithography and deposited with a thickness of 100 nm. A 3 nm titanium adhesion layer was deposited, prior

Surface improvement of organic photoresists using a near-field-dependent etching method

• Felix J. Brandenburg,
• Tomohiro Okamoto,
• Hiroshi Saito,
• Benjamin Leuschel,
• Olivier Soppera and
• Takashi Yatsui

Beilstein J. Nanotechnol. 2017, 8, 784–788, doi:10.3762/bjnano.8.81

• feature size year-by-year in order to sustain Moore’s Law [3][4], new processing techniques [5] as well as materials [6] are constantly being explored. One important criterion for new materials and techniques is their SR value, and the reduction of the SR is of great interest for high-end lithography

• and play an important role in high-end integrated circuit (IC) chip production. Since the quality of IC semiconductors is directly dependent on their SR, an improvement in the structure of the photoresist during the lithography process could significantly improve the quality of the semiconductor end

• was prepared using interference lithography. Specifically, the chemically amplified resist (EPIC 2096 ArF Photoresist) with an absorption edge of 310 nm was used. To observe the wavelength dependence, the continuous-wave (CW) laser sources used in these experiments were: (1) He–Cd laser (325 nm; 3.81

Vapor deposition routes to conformal polymer thin films

• Priya Moni,
• Ahmed Al-Obeidi and
• Karen K. Gleason

Beilstein J. Nanotechnol. 2017, 8, 723–735, doi:10.3762/bjnano.8.76

• CVD both in conformality and functional group retention for the deposition of conformal sensing molecules on microfluidic devices [30]. This concept was later used to enable PDMS-free microfluidic devices for oxygen-free flow-lithography, a process that can generate multifunctional micro and nano

Phospholipid arrays on porous polymer coatings generated by micro-contact spotting

• Sylwia Sekula-Neuner,
• Monica de Freitas,
• Lea-Marie Tröster,
• Tobias Jochum,
• Pavel A. Levkin,
• Michael Hirtz and
• Harald Fuchs

Beilstein J. Nanotechnol. 2017, 8, 715–722, doi:10.3762/bjnano.8.75

• software as previously described in [17]. Phospholipid array on nanoporous HEMA-EDMA polymer. a) Phospholipid microcontact spotting on porous HEMA-EDMA with microchannel cantilevers imaged in situ on the lithography system. b) Fluorescence microscopy image of the DOPC phospholipid array doped with

Silicon microgrooves for contact guidance of human aortic endothelial cells

• Sara Fernández-Castillejo,
• Pilar Formentín,
• Úrsula Catalán,
• Josep Pallarès,
• Lluís F. Marsal and
• Rosa Solà

Beilstein J. Nanotechnol. 2017, 8, 675–681, doi:10.3762/bjnano.8.72

• alkaline etch. A thin layer of positive photoresist AZ 1505 (MicroChemicals) was deposited by spin-coating on the silicon wafer at 500 rpm for 10 s then 5000 rpm for 30 s, following by baking at 100 °C for 30 s. Then the wafer was patterned by direct-write lithography (DWL 66FS, Heidelberg Instruments Gmbh

Computing the T-matrix of a scattering object with multiple plane wave illuminations

• Martin Fruhnert,
• Ivan Fernandez-Corbaton,
• Vassilios Yannopapas and
• Carsten Rockstuhl

Beilstein J. Nanotechnol. 2017, 8, 614–626, doi:10.3762/bjnano.8.66

• metallic disks, usually separated by a dielectric spacer layer. This particle is preferably fabricated by top-down procedures, such as electron beam lithography [5][45]. The investigated object has a disk radius of 60 nm, a disk height of 30 nm and a gap thickness of 10 nm. The metal disks consist of gold

Anodization-based process for the fabrication of all niobium nitride Josephson junction structures

• Massimiliano Lucci,
• Ivano Ottaviani,
• Matteo Cirillo,
• Fabio De Matteis,
• Roberto Francini,
• Vittorio Merlo and
• Ivan Davoli

Beilstein J. Nanotechnol. 2017, 8, 539–546, doi:10.3762/bjnano.8.58

• using a mixture of argon and nitrogen. The process parameters were optimized by monitoring the plasma with an optical spectroscopy technique. This technique allowed us to obtain NbN as well as good quality AlN films and both were used to obtain NbN/AlN/NbN trilayers. Lift-off lithography and selective

• processes for defining patterns on NbN thin films are typically based on ion etching and subsequent deposition of insulating layers [9][10][11]. We have tried to limit our fabrication recipe instead to minimal procedures, namely just lift-off lithography and selective anodization. By using lift-off

• lithography aggressive and high-energy etching processes such as ion milling and reactive ion etching (RIE) can be avoided. The use of anodization can reduce the number of mask and photolithography steps. In particular, it is not necessary to deposit further insulators to separate different metals in

Copper atomic-scale transistors

• Fangqing Xie,
• Maryna N. Kavalenka,
• Moritz Röger,
• Daniel Albrecht,
• Hendrik Hölscher,
• Jürgen Leuthold and
• Thomas Schimmel

Beilstein J. Nanotechnol. 2017, 8, 530–538, doi:10.3762/bjnano.8.57

• and operation of the transistor in situ, and to test the operation of copper atomic-scale transistors in small volumes of electrolyte necessary for on-chip integration, chips with a circular window for containing the electrolyte were designed and fabricated with another standard lithography method

Sub-nanosecond light-pulse generation with waveguide-coupled carbon nanotube transducers

• Felix Pyatkov,
• Svetlana Khasminskaya,
• Vadim Kovalyuk,
• Frank Hennrich,
• Manfred M. Kappes,
• Gregory N. Goltsman,
• Wolfram H. P. Pernice and
• Ralph Krupke

Beilstein J. Nanotechnol. 2017, 8, 38–44, doi:10.3762/bjnano.8.5

• electron beam lithography on top of Si3N4/SiO2/Si substrate. Au/Cr contacts were produced by physical vapor deposition, and 600 nm wide, half-etched Si3N4-waveguides were formed with reactive ion etching. A typical sample contains tens of contact pairs and CNTs that were placed in between using

Nanostructured SnO₂–ZnO composite gas sensors for selective detection of carbon monoxide

• Paul Chesler,
• Cristian Hornoiu,
• Susana Mihaiu,
• Cristina Vladut,
• Jose Maria Calderon Moreno,
• Mihai Anastasescu,
• Carmen Moldovan,
• Bogdan Firtat,
• Costin Brasoveanu,
• George Muscalu,
• Ion Stan and
• Mariuca Gartner

Beilstein J. Nanotechnol. 2016, 7, 2045–2056, doi:10.3762/bjnano.7.195

• the optimum design of the transducer’s Pt heater, and b) fabrication of the transducer using mask technology and laser lithography on dedicated equipment, namely the Heidelberg DWL66FS, and wafer processing using photolithographic process with double-side alignment, metal etching and lift-off process

• microprocessing technology. The masks for the heater and the interdigital electrode were patterned onto a porous alumina substrate (wafer) using photolithography, etching and lift-off processes. Using the working protocol of the laser lithography dedicated equipment (Heidelberg DWL66FS), the design was

Effect of Anderson localization on light emission from gold nanoparticle aggregates

• Mohamed H. Abdellatif,
• Marco Salerno,
• Gaser N. Abdelrasoul,
• Ioannis Liakos,
• Alice Scarpellini,
• Sergio Marras and
• Alberto Diaspro

Beilstein J. Nanotechnol. 2016, 7, 2013–2022, doi:10.3762/bjnano.7.192

• localization is due to the increase of the radiative process in the localized field. These results suggest that by fabricating special surface patterns using electron beam lithography or by self-assembly, the localization of light can be engineered. The possibility to generate Anderson localization by control

Thickness-modulated tungsten–carbon superconducting nanostructures grown by focused ion beam induced deposition for vortex pinning up to high magnetic fields

• Ismael García Serrano,
• Javier Sesé,
• Isabel Guillamón,
• Hermann Suderow,
• Sebastián Vieira,
• Manuel Ricardo Ibarra and
• José María De Teresa

Beilstein J. Nanotechnol. 2016, 7, 1698–1708, doi:10.3762/bjnano.7.162

• current. In the present work, we exploit such a strategy to create linear-shape vortex-pinning landscapes in W–C films grown by FIBID. In sharp contrast with the use of other growth and lithography techniques that require several steps (with the risk of increasing the random pinning produced by defects

• ][29][30][31][32][33][34][35][36][37][38][39][40][41][42][43][44][45]. In order to design vortex-pinning landscapes, electron beam lithography is commonly used to fabricate arrays of holes [33][40] or arrays of magnetic dots/lines [30][34][36][39][41], whereas selective ion implantation [29][38][41

Nano- and microstructured materials for in vitro studies of the physiology of vascular cells

• Alexandra M. Greiner,
• Adria Sales,
• Hao Chen,
• Sarah A. Biela,
• Dieter Kaufmann and
• Ralf Kemkemer

Beilstein J. Nanotechnol. 2016, 7, 1620–1641, doi:10.3762/bjnano.7.155

• beam lithography, stereolithography, direct laser writing, and block co-polymer micellar nanolithography are applied. Based on the fabrication approach, fabrication techniques can be divided whether they follow a top-down approach or a bottom-up approach. In the first approach, an already existing bulk

• form the topography of the features in the plastic. Similar to replica molding in soft lithography, features down to around 10 nm can be replicated. Like soft lithography hot embossing is a cheap method suitable for large-scale manufacturing of substrates [50]. In principle, it can be used with many

• cell adaptation to dynamic changes of the substrate topography [51][52]. Replica molding is a soft lithography technique that uses an elastomeric soft material to replicate patterns (Figure 4B) [53][54]. With that method mainly micrometer-sized topographies are produced in the elastomer. Structures

Nonlinear thermoelectric effects in high-field superconductor-ferromagnet tunnel junctions

• Stefan Kolenda,
• Peter Machon,
• Detlef Beckmann and
• Wolfgang Belzig

Beilstein J. Nanotechnol. 2016, 7, 1579–1585, doi:10.3762/bjnano.7.152

• experimental data (see below). Experiment and Results Our samples were fabricated by e-beam lithography and shadow evaporation. The central part is a tunnel junction between ferromagnetic iron and superconducting aluminum, with a thin aluminum oxide layer as tunnel barrier. An additional copper wire is

Graphene-enhanced plasmonic nanohole arrays for environmental sensing in aqueous samples

• Christa Genslein,
• Peter Hausler,
• Eva-Maria Kirchner,
• Rudolf Bierl,
• Antje J. Baeumner and
• Thomas Hirsch

Beilstein J. Nanotechnol. 2016, 7, 1564–1573, doi:10.3762/bjnano.7.150

• lithography; surface plasmon resonance; Introduction Plasticizers are additives used in plastic industry, personal care products and especially in polyvinyl chloride (PVC) products. The most common plasticizers are phthalate acid esters (PAEs) [1]. Since PAEs are not chemically bound to the polymeric matrix

• reproducibility it has been applied for biosensor development and theoretical studies. With high fabrication costs and long milling times it is not adaptable to large volume manufacturing [24][25][26]. Standard lithography techniques can instead be used such as soft embossing. An imprinting mask is prepared by e

• -beam lithography and by printing numerous times on a surface, large areas of nanoholes are created [27][28][29][30]. Since for each different nanohole layout a new mask needs to be fabricated, this method is still time consuming and unfavorable for optimization studies. To provide tunability, rapid

Effect of tetramethylammonium hydroxide/isopropyl alcohol wet etching on geometry and surface roughness of silicon nanowires fabricated by AFM lithography

• Siti Noorhaniah Yusoh and
• Khatijah Aisha Yaacob

Beilstein J. Nanotechnol. 2016, 7, 1461–1470, doi:10.3762/bjnano.7.138

• important role in the fabrication of semiconductor devices. Wet etching of tetramethylammonium hydroxide (TMAH)/isopropyl alcohol (IPA) on silicon nanowires fabricated by AFM lithography is studied herein. TMAH (25 wt %) with different IPA concentrations (0, 10, 20, and 30 vol %) and etching time durations

• performance for many applications. Keywords: AFM lithography; isopropyl alcohol; silicon nanowires; tetramethylammonium hydroxide; wet etching; Introduction The fabrication of semiconductor devices on silicon-on-insulator (SOI) wafers has recently become popular. Devices necessary for meeting the

• have been a few studies on the TMAH/IPA anisotropic etching, but the studies have not investigated the etched product. In this paper, we studied TMAH/IPA wet etching for the fabrication of an array of silicon nanowire patterned by AFM lithography on an SOI wafer. We investigate the relationship between

Dealloying of gold–copper alloy nanowires: From hillocks to ring-shaped nanopores

• Adrien Chauvin,
• Cyril Delacôte,
• Mohammed Boujtita,
• Benoit Angleraud,
• Junjun Ding,
• Chang-Hwan Choi,
• Pierre-Yves Tessier and
• Abdel-Aziz El Mel

Beilstein J. Nanotechnol. 2016, 7, 1361–1367, doi:10.3762/bjnano.7.127

• of metal nanowires (Figure 1a). We show how controlling accurately the growth of such defects can be of real benefit for engineering the surface of nanowires. At first, a photoresist film is deposited by spin coating on a silicon substrate and then patterned using laser interference lithography

• two-step approach consisting of laser interference lithography using a NR7-250P photoresist followed by deep reactive ion etching. Such substrates consist of nanograted silicon structures (120 nm in width and 1000 nm in height) of 220 nm in pitch with an aspect ratio of about 6. Growth of nanowires

• a nodular morphology. The stages of the process are as follow: (1) nanopatterning on a photoresist film on a silicon substrate using laser interference lithography, (2) etching the silicon substrate through the photoresist mask to form nanograted silicon structures, (3) partial etching of the

Role of solvents in the electronic transport properties of single-molecule junctions

• Katharina Luka-Guth,
• Sebastian Hambsch,
• Andreas Bloch,
• Philipp Ehrenreich,
• Bernd Michael Briechle,
• Filip Kilibarda,
• Torsten Sendler,
• Dmytro Sysoiev,
• Thomas Huhn,
• Artur Erbe and
• Elke Scheer

Beilstein J. Nanotechnol. 2016, 7, 1055–1067, doi:10.3762/bjnano.7.99

• is annealed for 6 h at 430 °C in vacuum (10−5 mbar). The polyimide layer serves as an electrical insulator and a sacrificial layer in the subsequent etching process. Prior to performing the electron beam lithography performed in a FEI scanning electron microscope XL30 equipped with a pattern

A terahertz-vibration to terahertz-radiation converter based on gold nanoobjects: a feasibility study

• Kamil Moldosanov and
• Andrei Postnikov

Beilstein J. Nanotechnol. 2016, 7, 983–989, doi:10.3762/bjnano.7.90

• in mind the care to be taken. The second remark is that the above estimated dimensions of GNBs and GNRs are on the edge in yet another way, namely, their size is at the resolution limit for available lithographic techniques (intrinsic resolution of the electron beam lithography [12] is 3–5 nm

• substrate or embedded into a matrix transparent in the THz wavelength range. As for GNRs, Tseng et al. [16] fabricated nanorings using the colloidal lithography process. Hopefully, it could be tailored to provide the GNR sizes estimated here. Summarizing, fully aware that extremely small size nanoobjects

Dielectrophoresis of gold nanoparticles conjugated to DNA origami structures

• Anja Henning-Knechtel,
• Matthew Wiens,
• Mathias Lakatos,
• Andreas Heerwig,
• Frieder Ostermaier,
• Nora Haufe and
• Michael Mertig

Beilstein J. Nanotechnol. 2016, 7, 948–956, doi:10.3762/bjnano.7.87

• are difficult to realize with lithographic methods such as e-beam lithography or AFM manipulation [44]. The different behavior of modified and unmodified origami structures can be also useful for the fast verification of DNA origami modifications as well as separation of different species of DNA

• and left to dry for 10–15 min before imaging. Preparation of the microelectrode contact array Micro-patterned gold electrodes were prepared on glass slides by optical lithography. For this, the glass slides (16 × 16 mm, 0.13–0.16 mm thick) were first cleaned in a piranha solution [30 mL H2SO4 (95–97

Large-scale fabrication of achiral plasmonic metamaterials with giant chiroptical response

• Morten Slyngborg,
• Yao-Chung Tsao and
• Peter Fojan

Beilstein J. Nanotechnol. 2016, 7, 914–925, doi:10.3762/bjnano.7.83

• aluminum foil, nanoimprint lithography and glancing angle deposition. All of these techniques are scalable and pose a significant improvement to standard metamaterial fabrication techniques. Different interpore distances and glancing angle depositions enable the plasmonic resonance wavelength to be tunable

• beam lithography or focused ion beam milling, which both are expensive and time consuming methods. Large-scale fabrication of PCMs have been attempted to some degree applying different approaches such as glancing angle deposition [28], scaffold ornamentation [29][30], individual chiral nanoparticles

• nanotubes [27] and larger U-shaped structures by nanoimprint lithography (NIL) [38] which have been scalably fabricated. In the present work we present a novel route towards the large-scale fabrication of ECMs and metamaterials in general. These structures have never been reported before and add to the

Direct formation of gold nanorods on surfaces using polymer-immobilised gold seeds

• Majid K. Abyaneh,
• Pietro Parisse and
• Loredana Casalis

Beilstein J. Nanotechnol. 2016, 7, 809–816, doi:10.3762/bjnano.7.72

• noble metal NRs or NWs with various techniques, such as electron-beam lithography [14][15], Langmuir–Blodgett (L–B) methods [16], stretched polymer matrices [17], self-assembly [18][19][20], and electric fields [21]. However, both direct and indirect surface-growth approaches present significant

• formed by UV photoreduction. PMMA has amazing properties such as transparency, flexibility and light weight. Moreover, it is able to immobilise the nanoparticles avoiding their agglomeration and thus maintaining the novel size-dependent properties of nanomaterials. PMMA is widely used in lithography and

Thermo-voltage measurements of atomic contacts at low temperature

• Ayelet Ofarim,
• Bastian Kopp,
• Thomas Möller,
• León Martin,
• Johannes Boneberg,
• Paul Leiderer and
• Elke Scheer

Beilstein J. Nanotechnol. 2016, 7, 767–775, doi:10.3762/bjnano.7.68

• gradient is achieved by illuminating the sample locally with a focused laser beam. Results and Discussion Realization of the thermopower measurement The sample was prepared by electron-beam lithography as described earlier [22] but using Kapton Cirlex as substrate material instead of the typical break

• length. A drawback of using this (thermally and) electronically insulating substrate was the necessity to overcome the charge-caused deterioration of the electron-beam during the lithography process. To do so, substrates were covered by a thin 10 nm Al film on top of the standard photoresist (MAA/PMMA

• ). This metal layer was removed after electron-beam lithography by soaking the sample in a sodium hydroxide solution for few tens of seconds. An optical cryostat was used, allowing measurements at 77 K or 4 K. Preliminary measurements have shown the necessity to work at low temperature to enhance temporal